Presentation 2004/11/4
Resist-removal technique without plasma using hydrogen atoms generated on heated catalyzer
Atsushi MASUDA, Kouhei HASHIMOTO, Kazuhisa TAKAO, Tomoatsu ISHIBASHI, Hideki MATSUMURA,
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Abstract(in English) Resist-removal technique without plasma using high-density hydrogen atoms generated on heated catalyzer is introduced. Both no plasma damage and no oxidation for the substrate under the resist are advantages of this process in comparison with the conventional oxygen plasma ashing. However, slow removal rate had been a problem to be solved. In this study, hydrogen flow rate, hydrogen pressure, catalyzer temperature, wafer-stage temperature and distance between catalyzer and wafer were widely changed and resist-removal rate faster than 1 μm/min was realized in the optimized condition. This removal rate should be applicable level in industry. Concentration of tungsten on wafer, possibly evaporated from the catalyzer, was estimated to be the first half of 10^<10> cm^<-2>, which brings about no problem for industrial application.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Resist removal / Heated catalyzer / Hydrogen atoms / Plasmaless process
Paper # CPM2004-134
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Committee CPM
Conference Date 2004/11/4(1days)
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Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Resist-removal technique without plasma using hydrogen atoms generated on heated catalyzer
Sub Title (in English)
Keyword(1) Resist removal
Keyword(2) Heated catalyzer
Keyword(3) Hydrogen atoms
Keyword(4) Plasmaless process
1st Author's Name Atsushi MASUDA
1st Author's Affiliation School of Materials Science, Japan Advanced Institute of Science and Technology()
2nd Author's Name Kouhei HASHIMOTO
2nd Author's Affiliation School of Materials Science, Japan Advanced Institute of Science and Technology
3rd Author's Name Kazuhisa TAKAO
3rd Author's Affiliation Tokyo Ohka Kogyo Co., Ltd.
4th Author's Name Tomoatsu ISHIBASHI
4th Author's Affiliation Tokyo Ohka Kogyo Co., Ltd.
5th Author's Name Hideki MATSUMURA
5th Author's Affiliation School of Materials Science, Japan Advanced Institute of Science and Technology
Date 2004/11/4
Paper # CPM2004-134
Volume (vol) vol.104
Number (no) 425
Page pp.pp.-
#Pages 5
Date of Issue