Presentation 2004/11/4
Growth of preferentially oriented Cu(111) layer on randomly oriented ZrN barrier in Cu/ZrN/Si contact
Masaru SATOH, Mayumi B. TAKEYAMA, Atsushi NOYA,
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Abstract(in English) In Si-ULSI metallization technology, the growth of a Cu(111) preferentially oriented film is an important factor in the improvement of the electromigration reliability. We examined the application of a randomly oriented ZrN film with an extremely N-rich composition as a diffusion barrier, on which a highly oriented Cu(111) film will be obtained. This is because the good lattice matching between the ZrN(111) and Cu(111) planes is obtained by expanding the ZrN lattice due to incorporating the excess nitrogen atoms into the ZrN film. It is revealed that the Cu(111) preferred orientation (ω-FWHM value of ~5°) is realized on the randomly oriented ZrN barrier with good barrier properties.
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Keyword(in English) Cu interconnect / lattice matching / Cu(111) preferential orientation / randomly oriented films / electromigration
Paper # CPM2004-131
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Committee CPM
Conference Date 2004/11/4(1days)
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Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Growth of preferentially oriented Cu(111) layer on randomly oriented ZrN barrier in Cu/ZrN/Si contact
Sub Title (in English)
Keyword(1) Cu interconnect
Keyword(2) lattice matching
Keyword(3) Cu(111) preferential orientation
Keyword(4) randomly oriented films
Keyword(5) electromigration
1st Author's Name Masaru SATOH
1st Author's Affiliation Dept. of Electrical and Electronic Enginnering Kitami Inst. of Technol()
2nd Author's Name Mayumi B. TAKEYAMA
2nd Author's Affiliation Dept. of Electrical and Electronic Enginnering Kitami Inst. of Technol
3rd Author's Name Atsushi NOYA
3rd Author's Affiliation Dept. of Electrical and Electronic Enginnering Kitami Inst. of Technol
Date 2004/11/4
Paper # CPM2004-131
Volume (vol) vol.104
Number (no) 425
Page pp.pp.-
#Pages 6
Date of Issue