Presentation 2005/2/24
Chip-interleaved DS-CDMA with 2-dimensinal OVSF spreading code
Le LIU, Fumiyuki ADACHI,
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Abstract(in English) Multiuser interference (MUI) limits the transmission performance of the DS-CDMA uplink. In this paper, we propose a 2-dimensional (2-D) OVSF spreading and chip-interleaving to transform the multi-user channel into orthogonal single-user channels. Due to MUI cancellation, the chip-interleaved DS-CDMA with 2-D OVSF spreading has ability to increase the link capacity as well as to provide multi-rate services. Single-user frequency-domain equalization based on the minimum mean square error (MMSE) criterion is applied for signal detection. The transmission performance in a multiuser and frequency-selective fading environment is evaluated by computer simulation.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) DS-CDMA / multi-rate / uplink transmission / interleaving / OVSF
Paper # WBS2004-104,A・P2004-285,RCS2004-372,MoMuC2004-155,MW2004-282
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Committee MoMuC
Conference Date 2005/2/24(1days)
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Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Chip-interleaved DS-CDMA with 2-dimensinal OVSF spreading code
Sub Title (in English)
Keyword(1) DS-CDMA
Keyword(2) multi-rate
Keyword(3) uplink transmission
Keyword(4) interleaving
Keyword(5) OVSF
1st Author's Name Le LIU
1st Author's Affiliation Dept. of Electrical and Communication Engineering, Graduate School of Engineering, Tohoku University()
2nd Author's Name Fumiyuki ADACHI
2nd Author's Affiliation Dept. of Electrical and Communication Engineering, Graduate School of Engineering, Tohoku University
Date 2005/2/24
Paper # WBS2004-104,A・P2004-285,RCS2004-372,MoMuC2004-155,MW2004-282
Volume (vol) vol.104
Number (no) 682
Page pp.pp.-
#Pages 6
Date of Issue