Presentation 1998/7/24
A Study on Junction Profile near Si/Oxide Interface due to Transient Enhanced Diffusion Effect in MOSFET
Jeonghwan Son, Hyunwook Song, Seunfho Lee,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Source/drain junction profile of MOSFET with trench isolation was studied by using process simulation with TED model.It was observed that the junction depth near the Si/oxide interface is much shallower than that of the bulk region.The origin of the shallow junction formation near the interface is related to TED caused by source/drain implantation damage.The shallow junction was formed due to the counter doping by B pile-up in NMOS but it was formed due to the retardation of B diffusion and B segregation in PMOS.The junction leakage for MOSFET with N_2O annealed interface was reduced and this result was well determined by simulation result.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Si/Oxide Interface / Transient Enhanced Diffusion / Interstitial / Junction Leakage
Paper # SDM98-94,ICD98-93
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Committee SDM
Conference Date 1998/7/24(1days)
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Paper Information
Registration To Silicon Device and Materials (SDM)
Language KOR
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A Study on Junction Profile near Si/Oxide Interface due to Transient Enhanced Diffusion Effect in MOSFET
Sub Title (in English)
Keyword(1) Si/Oxide Interface
Keyword(2) Transient Enhanced Diffusion
Keyword(3) Interstitial
Keyword(4) Junction Leakage
1st Author's Name Jeonghwan Son
1st Author's Affiliation R&D Division, LG Semicon Co. Ltd.()
2nd Author's Name Hyunwook Song
2nd Author's Affiliation R&D Division, LG Semicon Co. Ltd.
3rd Author's Name Seunfho Lee
3rd Author's Affiliation R&D Division, LG Semicon Co. Ltd.
Date 1998/7/24
Paper # SDM98-94,ICD98-93
Volume (vol) vol.98
Number (no) 194
Page pp.pp.-
#Pages 6
Date of Issue