講演名 | 1998/7/24 A Study on Junction Profile near Si/Oxide Interface due to Transient Enhanced Diffusion Effect in MOSFET , |
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抄録(和) | |
抄録(英) | Source/drain junction profile of MOSFET with trench isolation was studied by using process simulation with TED model.It was observed that the junction depth near the Si/oxide interface is much shallower than that of the bulk region.The origin of the shallow junction formation near the interface is related to TED caused by source/drain implantation damage.The shallow junction was formed due to the counter doping by B pile-up in NMOS but it was formed due to the retardation of B diffusion and B segregation in PMOS.The junction leakage for MOSFET with N_2O annealed interface was reduced and this result was well determined by simulation result. |
キーワード(和) | |
キーワード(英) | Si/Oxide Interface / Transient Enhanced Diffusion / Interstitial / Junction Leakage |
資料番号 | SDM98-94,ICD98-93 |
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研究会情報 | |
研究会 | SDM |
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開催期間 | 1998/7/24(から1日開催) |
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講演論文情報詳細 | |
申込み研究会 | Silicon Device and Materials (SDM) |
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本文の言語 | KOR |
タイトル(和) | |
サブタイトル(和) | |
タイトル(英) | A Study on Junction Profile near Si/Oxide Interface due to Transient Enhanced Diffusion Effect in MOSFET |
サブタイトル(和) | |
キーワード(1)(和/英) | / Si/Oxide Interface |
第 1 著者 氏名(和/英) | / Jeonghwan Son |
第 1 著者 所属(和/英) | R&D Division, LG Semicon Co. Ltd. |
発表年月日 | 1998/7/24 |
資料番号 | SDM98-94,ICD98-93 |
巻番号(vol) | vol.98 |
号番号(no) | 194 |
ページ範囲 | pp.- |
ページ数 | 6 |
発行日 |