Presentation 1998/7/24
Gate Oxide Formation at Low Temperature using UV-O_2 Oxidation
A. Teramoto, Y. Ohno, H. Miyoshi,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We have developed and evaluated SiO_2 films formed in a dry oxygen ambient at 600-900℃ under ultraviolet irradiation (UV-O_2 oxidation).It has been found that the TDDB, stress induced leakage current and the hole-trapping characteristics of SiO_2 films formed by the UV-O_2 oxidation at 900℃, are superior to those formed by the conventional dry oxidation.The TDDB lifetime of the SiO_2 films formed by the UV-O_2 oxidation at 600℃ is also longer than that formed by the conventional dry oxidation at 900℃ and wet oxidation at 600℃.These facts indicate that the highly reliable gate oxide is realized by the UV-O_2 oxidation.The UV-O_2 oxidation.technology is very useful for the production of future devices which require low-temperature processing.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) silicon dioxide / ultraviolet rays / low temperature oxidation / TDDB / SILC / hole trap
Paper # SDM98-93,ICD98-92
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Conference Information
Committee SDM
Conference Date 1998/7/24(1days)
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Registration To Silicon Device and Materials (SDM)
Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Gate Oxide Formation at Low Temperature using UV-O_2 Oxidation
Sub Title (in English)
Keyword(1) silicon dioxide
Keyword(2) ultraviolet rays
Keyword(3) low temperature oxidation
Keyword(4) TDDB
Keyword(5) SILC
Keyword(6) hole trap
1st Author's Name A. Teramoto
1st Author's Affiliation Mitsubishi Electric Corporation, ULSI Development Center()
2nd Author's Name Y. Ohno
2nd Author's Affiliation Mitsubishi Electric Corporation, ULSI Development Center
3rd Author's Name H. Miyoshi
3rd Author's Affiliation Mitsubishi Electric Corporation, ULSI Development Center
Date 1998/7/24
Paper # SDM98-93,ICD98-92
Volume (vol) vol.98
Number (no) 194
Page pp.pp.-
#Pages 6
Date of Issue