| Presentation | 1994/5/19 Auger electron spectroscopy study on the thermal stability of Cu/ Ta_2Al/Ta/Si contact structure Akira Ohta, Atsushi Noya, Mayumi Takeyama, Katsutaka Sasaki, Masahiro Taguchi, |
|---|---|
| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | The intermetallic compound film of Ta_2Al was prepared by co- sputtering.The layered film of Ta_2Al, Ta was used as a diffusion barrier in the Cu/Ta_2Al/Ta/Si contact system.The annealing experiment showed that the system was still stable up to an annealing temperature of 650℃,though a part of the Ta layer was ex hausted by the silicidation reaction at the Ta/Si interface. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Cu metallization technology / diffusion barrier / Ta_2Al intermetallic compound film / metal-semiconductor contact / Cu- interconnect line |
| Paper # | CPM94-1 |
| Date of Issue |
| Conference Information | |
| Committee | CPM |
|---|---|
| Conference Date | 1994/5/19(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
|---|---|
| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Auger electron spectroscopy study on the thermal stability of Cu/ Ta_2Al/Ta/Si contact structure |
| Sub Title (in English) | |
| Keyword(1) | Cu metallization technology |
| Keyword(2) | diffusion barrier |
| Keyword(3) | Ta_2Al intermetallic compound film |
| Keyword(4) | metal-semiconductor contact |
| Keyword(5) | Cu- interconnect line |
| 1st Author's Name | Akira Ohta |
| 1st Author's Affiliation | Department of Electrical and Electronic Engineering,Faculty of Engineering,Kitami Institute of Technology() |
| 2nd Author's Name | Atsushi Noya |
| 2nd Author's Affiliation | Department of Electrical and Electronic Engineering,Faculty of Engineering,Kitami Institute of Technology |
| 3rd Author's Name | Mayumi Takeyama |
| 3rd Author's Affiliation | Department of Electrical and Electronic Engineering,Faculty of Engineering,Kitami Institute of Technology |
| 4th Author's Name | Katsutaka Sasaki |
| 4th Author's Affiliation | Department of Electrical and Electronic Engineering,Faculty of Engineering,Kitami Institute of Technology |
| 5th Author's Name | Masahiro Taguchi |
| 5th Author's Affiliation | Department of Electrical and Electronic Engineering,Faculty of Engineering,Kitami Institute of Technology |
| Date | 1994/5/19 |
| Paper # | CPM94-1 |
| Volume (vol) | vol.94 |
| Number (no) | 39 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |