| Presentation | 2001/12/13 Thermal Design of the 3D Die-stacked Module Yasuhiro YAMAJI, Tatsuya ANDO, Tadahiro MORIFUJI, Tomotoshi SATO, Kenji TAKAHASHI, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | To examine thermal characteristics of the three dimensional (3D) modules, where four bare-dies with Cuthrough-vias are vertically stacked, thermal resistance measurements by laser-flash method and parametric numerical analyses were carried out. The key factors governing the thermal performance of the 3D module and the design guideline of the thermal vias/bumps are presented. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | 3-dimensional / Stack module / Through-via / Thermal resistance / Laser-Flash method / Thermal-via |
| Paper # | CPM-121,ICD-173 |
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| Conference Information | |
| Committee | ICD |
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| Conference Date | 2001/12/13(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Thermal Design of the 3D Die-stacked Module |
| Sub Title (in English) | |
| Keyword(1) | 3-dimensional |
| Keyword(2) | Stack module |
| Keyword(3) | Through-via |
| Keyword(4) | Thermal resistance |
| Keyword(5) | Laser-Flash method |
| Keyword(6) | Thermal-via |
| 1st Author's Name | Yasuhiro YAMAJI |
| 1st Author's Affiliation | Electronic System Integration Technology Research Department Association of Super-Advanced Electronics Technologies(ASET)() |
| 2nd Author's Name | Tatsuya ANDO |
| 2nd Author's Affiliation | Electronic System Integration Technology Research Department Association of Super-Advanced Electronics Technologies(ASET) |
| 3rd Author's Name | Tadahiro MORIFUJI |
| 3rd Author's Affiliation | Electronic System Integration Technology Research Department Association of Super-Advanced Electronics Technologies(ASET) |
| 4th Author's Name | Tomotoshi SATO |
| 4th Author's Affiliation | Electronic System Integration Technology Research Department Association of Super-Advanced Electronics Technologies(ASET) |
| 5th Author's Name | Kenji TAKAHASHI |
| 5th Author's Affiliation | Electronic System Integration Technology Research Department Association of Super-Advanced Electronics Technologies(ASET) |
| Date | 2001/12/13 |
| Paper # | CPM-121,ICD-173 |
| Volume (vol) | vol.101 |
| Number (no) | 518 |
| Page | pp.pp.- |
| #Pages | 8 |
| Date of Issue | |