Presentation 2001/4/20
Metal Patterning on Organopolysilane-Coated Films by Electroless Deposition Structure Analysis of the Metal Pattern and the Improvement
Mikio ARAMATA, Eiichi TABEI, Yoshitaka HAMADA, Motoo FUKUSHIMA,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Palladium colloid was formed by the reductivity of polysilane, when a palladium salt solution was contacted to the polysilane film. It was possible to make metallic nickel and copper on the polysilane film by electroless deposition using palladium colloid as a catalyst. We have studied corrosion resistance and adhesive property of the metal film in order to apply to the flexible printed wiring board. In this study, the structure analysis of the multilayered metal pattern is reported.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Polysilane / Electroless deposition / Metal patterning / Flexible printed wiring board
Paper # OME2001-7
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Committee OME
Conference Date 2001/4/20(1days)
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Registration To Organic Material Electronics (OME)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Metal Patterning on Organopolysilane-Coated Films by Electroless Deposition Structure Analysis of the Metal Pattern and the Improvement
Sub Title (in English)
Keyword(1) Polysilane
Keyword(2) Electroless deposition
Keyword(3) Metal patterning
Keyword(4) Flexible printed wiring board
1st Author's Name Mikio ARAMATA
1st Author's Affiliation Gunma Division, Shin-Etsu Chemical Co., Ltd.()
2nd Author's Name Eiichi TABEI
2nd Author's Affiliation Silicone-Electronics Materials Research Center, Shin-Etsu Chemical Co., Ltd.
3rd Author's Name Yoshitaka HAMADA
3rd Author's Affiliation Silicone-Electronics Materials Research Center, Shin-Etsu Chemical Co., Ltd.
4th Author's Name Motoo FUKUSHIMA
4th Author's Affiliation Silicone-Electronics Materials Research Center, Shin-Etsu Chemical Co., Ltd.
Date 2001/4/20
Paper # OME2001-7
Volume (vol) vol.101
Number (no) 35
Page pp.pp.-
#Pages 5
Date of Issue