Presentation 2000/6/30
Basic study on SAW-semiconductor coupled device
T. Suda, Y. Aoki, C. Hong, C. Kaneshiro, K. Koh, K. Hohkawa,
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Abstract(in English) Surface acoustic wave (SAW) -semiconductor coupled devices are attractive for realization of high performance and new functional devices. In this paper, we report the basic study of SAW convolverefficiency in the points of non-linear effect of the interactions. And also, we have fabricated SAW devices with a high convolver efficiency and non-phase matching by using epitaxial lift off (ELO) film bonding process.
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Keyword(in English) SAW device / ELO Film Bonding Process / Convolver
Paper # US2000-29,EMD2000-25,CPM2000-40,OME2000-35
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Committee OME
Conference Date 2000/6/30(1days)
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Registration To Organic Material Electronics (OME)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Basic study on SAW-semiconductor coupled device
Sub Title (in English)
Keyword(1) SAW device
Keyword(2) ELO Film Bonding Process
Keyword(3) Convolver
1st Author's Name T. Suda
1st Author's Affiliation Dep. Electrical & Electronic Eng, Kanagawa Institute of Technology()
2nd Author's Name Y. Aoki
2nd Author's Affiliation Dep. Electrical & Electronic Eng, Kanagawa Institute of Technology
3rd Author's Name C. Hong
3rd Author's Affiliation Dep. Electrical & Electronic Eng, Kanagawa Institute of Technology
4th Author's Name C. Kaneshiro
4th Author's Affiliation Dep. Electrical & Electronic Eng, Kanagawa Institute of Technology
5th Author's Name K. Koh
5th Author's Affiliation Dep. Electrical & Electronic Eng, Kanagawa Institute of Technology
6th Author's Name K. Hohkawa
6th Author's Affiliation Dep. Electrical & Electronic Eng, Kanagawa Institute of Technology
Date 2000/6/30
Paper # US2000-29,EMD2000-25,CPM2000-40,OME2000-35
Volume (vol) vol.100
Number (no) 167
Page pp.pp.-
#Pages 6
Date of Issue