Presentation 2000/6/30
Basic Study of Bonding Process between Different Materials
C. Hong, C. Kaneshiro, S. Noge, Y. Aoki, K. Koh, T. Uno, K. Hohkawa,
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Abstract(in English) In this paper, we report results of study on the bonding process between piezoelectric substrate and semiconductor material. In order to realize rugged bonding interface between semiconductor material and piezoelectric substrate, we studied 1) surface state ( hydrophilic and roughness) of GaAs, Si, LiNbO_3 and quartz substrate for different treatment method, 2) effect of migration out of water molecules among bonding surface using radiation of microwave and laser. The experimental results clarified that these improvements in bonding process are effective to obtain stronger bonding interface between piezoelectric substrate and semiconductor material.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Epitaxial lift-off / Semiconductor / Van der Waals force / LiNbO_3 / Surface treatment. Film bonding / Wafer bonding / Piezoelectric substrate
Paper # US2000-28,EMD2000-24,CPM2000-39,OME2000-34
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Committee OME
Conference Date 2000/6/30(1days)
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Registration To Organic Material Electronics (OME)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Basic Study of Bonding Process between Different Materials
Sub Title (in English)
Keyword(1) Epitaxial lift-off
Keyword(2) Semiconductor
Keyword(3) Van der Waals force
Keyword(4) LiNbO_3
Keyword(5) Surface treatment. Film bonding
Keyword(6) Wafer bonding
Keyword(7) Piezoelectric substrate
1st Author's Name C. Hong
1st Author's Affiliation High technology research center, Kanagawa Institute of Technology()
2nd Author's Name C. Kaneshiro
2nd Author's Affiliation High technology research center, Kanagawa Institute of Technology
3rd Author's Name S. Noge
3rd Author's Affiliation High technology research center, Kanagawa Institute of Technology
4th Author's Name Y. Aoki
4th Author's Affiliation High technology research center, Kanagawa Institute of Technology
5th Author's Name K. Koh
5th Author's Affiliation High technology research center, Kanagawa Institute of Technology
6th Author's Name T. Uno
6th Author's Affiliation High technology research center, Kanagawa Institute of Technology
7th Author's Name K. Hohkawa
7th Author's Affiliation High technology research center, Kanagawa Institute of Technology
Date 2000/6/30
Paper # US2000-28,EMD2000-24,CPM2000-39,OME2000-34
Volume (vol) vol.100
Number (no) 167
Page pp.pp.-
#Pages 6
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