Presentation 1998/5/29
Patterned Polypyrrole Complex of Contact Probe for High Density Printed Wiring Boards
Yosuke ITAGAKI, Masaharu SATOH, Hajime KUZUMI,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) A contact probes for an error analysis of high density printed wiring boards utilizing a conducting polypyrrole complex have been prepared with the direct polymerization of pyrrole in a photosensitive resin matrix. The cylindrically formed complexes with 80μm diameter and 200μm high demonstrates the sufficiently low resistance of 200kΩ. Furthermore, they show the reversible deformation with compressed stress up to 20% of the initial length. These results indicate that the patterned polypyrrole complex should be useful as the probes for the high density printed wiring boards.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Conducting polymer / Polypyrrole / Contact pin / High density printed wiring board
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Committee OME
Conference Date 1998/5/29(1days)
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Registration To Organic Material Electronics (OME)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Patterned Polypyrrole Complex of Contact Probe for High Density Printed Wiring Boards
Sub Title (in English)
Keyword(1) Conducting polymer
Keyword(2) Polypyrrole
Keyword(3) Contact pin
Keyword(4) High density printed wiring board
1st Author's Name Yosuke ITAGAKI
1st Author's Affiliation Analysis and Evaluation Technology Center., NEC Corporation()
2nd Author's Name Masaharu SATOH
2nd Author's Affiliation Functional Devices Res. Labs., NEC Corporation
3rd Author's Name Hajime KUZUMI
3rd Author's Affiliation Analysis and Evaluation Technology Center., NEC Corporation
Date 1998/5/29
Paper #
Volume (vol) vol.98
Number (no) 92
Page pp.pp.-
#Pages 6
Date of Issue