Presentation 2002/9/24
Influence of Silicide-Block and Contact Resistance on Heating of ESD Protection Devices
Kazuya MATSUZAWA, Toyoaki MATSUASHI, Hirobumi KAWASHIMA,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) Silicide block is formed in on-chip ESD protection devices of grounded gate MOSFETs to suppress concentration of electric field. In this paper, simulation results for influences of resistivity and contact resistance of silicide on increase of lattice temperature within the protection devices are presented.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) ESD / Protection Device / Silicide Block / Contact Resistance
Paper # VLD2002-79
Date of Issue

Conference Information
Committee VLD
Conference Date 2002/9/24(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To VLSI Design Technologies (VLD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Influence of Silicide-Block and Contact Resistance on Heating of ESD Protection Devices
Sub Title (in English)
Keyword(1) ESD
Keyword(2) Protection Device
Keyword(3) Silicide Block
Keyword(4) Contact Resistance
1st Author's Name Kazuya MATSUZAWA
1st Author's Affiliation Advanced LSI Technology Laboratory, Toshiba Corporation()
2nd Author's Name Toyoaki MATSUASHI
2nd Author's Affiliation Semiconductor Company, Toshiba Corporation
3rd Author's Name Hirobumi KAWASHIMA
3rd Author's Affiliation Semiconductor Company, Toshiba Corporation
Date 2002/9/24
Paper # VLD2002-79
Volume (vol) vol.102
Number (no) 345
Page pp.pp.-
#Pages 6
Date of Issue