Presentation 1998/10/23
Process and Device Simulation of MOSFET Snapback Characteristics
N. Miura, K. Hisaka, K. Fukuda, Y. Fukuda, K. Nishi,
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Abstract(in English) In scaled-down process, high ESD(electrostatic discharge)performance is required for protection devices. In realistic stage of LSI development, process conditions are often changed after designing protection circuit. From requirement of fast LSI market, it is important to reduce additional costs and additional delay of development arising from these process modifications. In this paper, we propose a new strategy to predict snapback characteristics of protection MOSFETs in modefied process. This strategy is effective to reduce additional costs by offering quantitative insights of HBM(Human Body Model)properties.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Electrostatic discharge(ESD) / Snapback / MOSFET / Process and Device simulations
Paper # VLD98-95,ED98-120,SDM98-156,ICD98-226
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Committee VLD
Conference Date 1998/10/23(1days)
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Paper Information
Registration To VLSI Design Technologies (VLD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Process and Device Simulation of MOSFET Snapback Characteristics
Sub Title (in English)
Keyword(1) Electrostatic discharge(ESD)
Keyword(2) Snapback
Keyword(3) MOSFET
Keyword(4) Process and Device simulations
1st Author's Name N. Miura
1st Author's Affiliation VLSI Reserch & Development Center, Oki Electric Industry Co., Ltd.()
2nd Author's Name K. Hisaka
2nd Author's Affiliation VLSI Reserch & Development Center, Oki Electric Industry Co., Ltd.
3rd Author's Name K. Fukuda
3rd Author's Affiliation VLSI Reserch & Development Center, Oki Electric Industry Co., Ltd.
4th Author's Name Y. Fukuda
4th Author's Affiliation VLSI Reserch & Development Center, Oki Electric Industry Co., Ltd.
5th Author's Name K. Nishi
5th Author's Affiliation VLSI Reserch & Development Center, Oki Electric Industry Co., Ltd.
Date 1998/10/23
Paper # VLD98-95,ED98-120,SDM98-156,ICD98-226
Volume (vol) vol.98
Number (no) 346
Page pp.pp.-
#Pages 6
Date of Issue