Presentation	2001/4/13 Inter-Chip Optical Interconnection Using Optoelectronic Integration and Diffractive Optical Elements Takeshi TAKAMORI,
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Abstract(in English)	An inter-chip free-space optical interconnection technology is investigated to solve the pin-I/O bottleneck problem between LSI chips on a printed circuit. We have employed LSI chips that have integrated optical component and a planar photonic circuit that has diffractive optical elements to connect the arrayed optical beams from one LSI chip to the other. The integrated LSI chip is fabricated by direct wafer bonding technology. These two technologies are described in details with updated results that show the feasibility of our approach for the inter-chip optical interconnection.
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Keyword(in English)	Optical interconnection / Direct wafer bonding / Diffractive optical elements
Paper #	OCS2001-3
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Conference Information
Committee	OCS
Conference Date	2001/4/13(1days)
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Paper Information
Registration To	Optical Communication Systems (OCS)
Language	JPN
Title (in Japanese)	(See Japanese page)
Sub Title (in Japanese)	(See Japanese page)
Title (in English)	Inter-Chip Optical Interconnection Using Optoelectronic Integration and Diffractive Optical Elements
Sub Title (in English)
Keyword(1)	Optical interconnection
Keyword(2)	Direct wafer bonding
Keyword(3)	Diffractive optical elements
1st Author's Name	Takeshi TAKAMORI
1st Author's Affiliation	Optical Interconnection Oki Laboratory, Real World Computing Partnership()
Date	2001/4/13
Paper #	OCS2001-3
Volume (vol)	vol.101
Number (no)	21
Page	pp.pp.-
#Pages	4
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