Presentation 1997/2/21
Verification of thermal designin a mid-plane packaging system
Yoshitaka Shouno, Shin-ichi Kasuga, Mikio Abe,
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Abstract(in English) For a mid-plane packaging system has the advantage of kinds of interfaces, cooling performance is the most important issue. A heat evaluation equipment of the mid-plane packaging and bookshelf packaging system was developed and evaluated in a same cabinet. Then heat analysis was performed and cooling performance was measured. The result shows, the mid-plane packaging indicates mostly the same cooling performance to the bookshelf packaging, and will be able to apply to an existing cooling design technique. Furthermore, the 3-dimensional heat analysis shows useful results. In the near future, shortening of development TAT will be expected through the experiments of try & test.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) mid-plane packaging / thermal expenment / thermal analysis
Paper # SSE96-167,OCS96-105
Date of Issue

Conference Information
Committee OCS
Conference Date 1997/2/21(1days)
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Registration To Optical Communication Systems (OCS)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Verification of thermal designin a mid-plane packaging system
Sub Title (in English)
Keyword(1) mid-plane packaging
Keyword(2) thermal expenment
Keyword(3) thermal analysis
1st Author's Name Yoshitaka Shouno
1st Author's Affiliation 0ki Electric Industly Co.,Ltd.()
2nd Author's Name Shin-ichi Kasuga
2nd Author's Affiliation 0ki Electric Industly Co.,Ltd.
3rd Author's Name Mikio Abe
3rd Author's Affiliation 0ki Electric Industly Co.,Ltd.
Date 1997/2/21
Paper # SSE96-167,OCS96-105
Volume (vol) vol.96
Number (no) 538
Page pp.pp.-
#Pages 6
Date of Issue