Presentation 1997/11/4
Magnetooptic waveguides on InP substrate by wafer direct bonding technique
Hideki YOKOI, Tetsuya MIZUMOTO,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Feasibility of wafer direct bonding technique has been investigated for integrating a semiconductor laser diode with an optical isolator. The direct bonding between InP and magnetooptic waveguides with an SiO_2 cladding layer is demonstrated. An etching process of a semiconductor laser diode for integrating the two devices is also described.
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Keyword(in English) optical isolator / direct bonding / semiconductor laser diode / garnet
Paper # OCS97-51
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Conference Information
Committee OCS
Conference Date 1997/11/4(1days)
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Registration To Optical Communication Systems (OCS)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Magnetooptic waveguides on InP substrate by wafer direct bonding technique
Sub Title (in English)
Keyword(1) optical isolator
Keyword(2) direct bonding
Keyword(3) semiconductor laser diode
Keyword(4) garnet
1st Author's Name Hideki YOKOI
1st Author's Affiliation Department of Physical Electronics, Faculty of Engineering, Tokyo Institute of Technology()
2nd Author's Name Tetsuya MIZUMOTO
2nd Author's Affiliation Department of Physical Electronics, Faculty of Engineering, Tokyo Institute of Technology
Date 1997/11/4
Paper # OCS97-51
Volume (vol) vol.97
Number (no) 357
Page pp.pp.-
#Pages 6
Date of Issue