Presentation | 2002/1/10 The High Q Spiral Inductors in Wafer Level CSP Technology Yutaka AOKI, Yoshio KAMI, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | Recently, electronic equipments with high density and miniaturized packages are seen with keen. In fact, increasing the operating frequency can be considered as the most important parameter. In this article, we consider the idea of cupper-redistributed inductor in the technology of built-in passive elements. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Wafer Level CSP / inductor / high frequency / Passive Parts / built in passive element / High density mount technology |
Paper # | 2001-ED-210,2001-MW-165,2001-ICD-207 |
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Conference Information | |
Committee | ED |
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Conference Date | 2002/1/10(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
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Paper Information | |
Registration To | Electron Devices (ED) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | The High Q Spiral Inductors in Wafer Level CSP Technology |
Sub Title (in English) | |
Keyword(1) | Wafer Level CSP |
Keyword(2) | inductor |
Keyword(3) | high frequency |
Keyword(4) | Passive Parts |
Keyword(5) | built in passive element |
Keyword(6) | High density mount technology |
1st Author's Name | Yutaka AOKI |
1st Author's Affiliation | CASIO Computer() |
2nd Author's Name | Yoshio KAMI |
2nd Author's Affiliation | The University of Electro-Communications |
Date | 2002/1/10 |
Paper # | 2001-ED-210,2001-MW-165,2001-ICD-207 |
Volume (vol) | vol.101 |
Number (no) | 550 |
Page | pp.pp.- |
#Pages | 6 |
Date of Issue |