Presentation 2002/1/10
The High Q Spiral Inductors in Wafer Level CSP Technology
Yutaka AOKI, Yoshio KAMI,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Recently, electronic equipments with high density and miniaturized packages are seen with keen. In fact, increasing the operating frequency can be considered as the most important parameter. In this article, we consider the idea of cupper-redistributed inductor in the technology of built-in passive elements.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Wafer Level CSP / inductor / high frequency / Passive Parts / built in passive element / High density mount technology
Paper # 2001-ED-210,2001-MW-165,2001-ICD-207
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Committee ED
Conference Date 2002/1/10(1days)
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Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) The High Q Spiral Inductors in Wafer Level CSP Technology
Sub Title (in English)
Keyword(1) Wafer Level CSP
Keyword(2) inductor
Keyword(3) high frequency
Keyword(4) Passive Parts
Keyword(5) built in passive element
Keyword(6) High density mount technology
1st Author's Name Yutaka AOKI
1st Author's Affiliation CASIO Computer()
2nd Author's Name Yoshio KAMI
2nd Author's Affiliation The University of Electro-Communications
Date 2002/1/10
Paper # 2001-ED-210,2001-MW-165,2001-ICD-207
Volume (vol) vol.101
Number (no) 550
Page pp.pp.-
#Pages 6
Date of Issue