Presentation 2001/6/28
A NEW CHEMICAL MECHANICAL POLISHING METHOD USING THE FROZEN ETCHANT PAD
Youn-Jin Oh, Gyung-Soon Park, Sung Yong Park, Jae-Ok Ryu, Tae Woo Jung, Il-Wook Kim, Chan-Hwa Chung,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We have developed the new-concept CMP process named as the Forzen Chemical Etching (FCE) process, which uses a frozen etchant pad instead of conventional slurries and polymer pads. Bacause the polishing has been processed without the slurries and porous pad, we believe that the current difficulties in the conventional CMP process are possible solved. The performance of the frozen etchant polishing is strongly dependent on the chemical composition of the frozen etchant pad and the process temperatures. In our preliminary experimental results, we found that this new process concept should be applicable to the future device manufacturing technologies in microelectronics fabrication.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) chemical Mechanical Polishing / forzen Etchant pad / etching solution
Paper # ED2001-53, SDM2001-60
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Committee ED
Conference Date 2001/6/28(1days)
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Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A NEW CHEMICAL MECHANICAL POLISHING METHOD USING THE FROZEN ETCHANT PAD
Sub Title (in English)
Keyword(1) chemical Mechanical Polishing
Keyword(2) forzen Etchant pad
Keyword(3) etching solution
1st Author's Name Youn-Jin Oh
1st Author's Affiliation Dept.of Chemical Engineering, Sungkyunkwan University()
2nd Author's Name Gyung-Soon Park
2nd Author's Affiliation Dept.of Chemical Engineering, Sungkyunkwan University
3rd Author's Name Sung Yong Park
3rd Author's Affiliation Fine Semitech Co., Ltd.
4th Author's Name Jae-Ok Ryu
4th Author's Affiliation Hynix Semiconductor Inc.
5th Author's Name Tae Woo Jung
5th Author's Affiliation Hynix Semiconductor Inc.
6th Author's Name Il-Wook Kim
6th Author's Affiliation Hynix Semiconductor Inc.
7th Author's Name Chan-Hwa Chung
7th Author's Affiliation Dept.of Chemical Engineering, Sungkyunkwan University
Date 2001/6/28
Paper # ED2001-53, SDM2001-60
Volume (vol) vol.101
Number (no) 160
Page pp.pp.-
#Pages 6
Date of Issue