Presentation 2000/5/11
Deep level characterization for 3C-SiC/Si treated by a hydrogen plasma
F. Sobue, M. Kato, M. Ichimura, E. Arai, Y. Tokuda, N. Yamada,
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Abstract(in English) We attempted to passivate deep levels in 3C-SiC / Si by a hydrogen plasma treatment. Result of DLTS measurements, we show that deep levels exsting in the as-grown sample were passivated by the hydrogen plasma treatment. However we found new deep levels formed by damage of plasma treatment. The damage was eliminated by the annealing at 400゜C. After annealing at 500゜C the deep levels found in as-grown sample were reactivated because of the out diffusion of hydrogen during the annealing.
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Keyword(in English) 3C-SiC / plasma / hydrogen / deep level / DLTS measurement / anneal
Paper # ED2000-28, CPM2000-13, SDM2000-28
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Committee ED
Conference Date 2000/5/11(1days)
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Registration To Electron Devices (ED)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Deep level characterization for 3C-SiC/Si treated by a hydrogen plasma
Sub Title (in English)
Keyword(1) 3C-SiC
Keyword(2) plasma
Keyword(3) hydrogen
Keyword(4) deep level
Keyword(5) DLTS measurement
Keyword(6) anneal
1st Author's Name F. Sobue
1st Author's Affiliation Nagoya Institute of Technology()
2nd Author's Name M. Kato
2nd Author's Affiliation Nagoya Institute of Technology
3rd Author's Name M. Ichimura
3rd Author's Affiliation Nagoya Institute of Technology
4th Author's Name E. Arai
4th Author's Affiliation Nagoya Institute of Technology
5th Author's Name Y. Tokuda
5th Author's Affiliation Aichi Institute of Technology
6th Author's Name N. Yamada
6th Author's Affiliation Toyota Central Research and Development Laboratory
Date 2000/5/11
Paper # ED2000-28, CPM2000-13, SDM2000-28
Volume (vol) vol.100
Number (no) 57
Page pp.pp.-
#Pages 6
Date of Issue