Presentation 2000/7/21
Formation of ohmic contact in Cu-Zr/n-InP system by rapid thermal annealing
Mayumi B. TAKEYAMA, Junichi ITAI, Atsushi NOYA, Tamotsu HASHIZUME, Hideki HASEGAWA,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) The electrical property as well as the interfacial reaction and/or diffusion have been investigated in the Cu-Zr/InP contact to realize the thermally-stable ohmic contact to n-type InP. The application of the Cu-Zr amorphous alloy brings about the formation of the uniform interlayer at the Cu-Zr/InP interface suppressing the Cu diffusion into the InP substrate after rapid thermal annealing(RTA), resulting in the realization of the low contact resistivity at this interface upon RTA at 500℃ for 20s. It is revealed that the Cu-Zr amorphous alloy is one of the excellent materials applicable as an ohmic contact to n-type InP.
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Keyword(in English) metal-semiconductor interface / InP / ohmic contact / interfacial reaction / amorphous alloy
Paper # ED2000-103
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Committee ED
Conference Date 2000/7/21(1days)
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Registration To Electron Devices (ED)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Formation of ohmic contact in Cu-Zr/n-InP system by rapid thermal annealing
Sub Title (in English)
Keyword(1) metal-semiconductor interface
Keyword(2) InP
Keyword(3) ohmic contact
Keyword(4) interfacial reaction
Keyword(5) amorphous alloy
1st Author's Name Mayumi B. TAKEYAMA
1st Author's Affiliation Dept.of Electrical and Electronic Engineering, Kitami Institute of Technology()
2nd Author's Name Junichi ITAI
2nd Author's Affiliation Dept.of Electrical and Electronic Engineering, Kitami Institute of Technology
3rd Author's Name Atsushi NOYA
3rd Author's Affiliation Dept.of Electrical and Electronic Engineering, Kitami Institute of Technology
4th Author's Name Tamotsu HASHIZUME
4th Author's Affiliation Research Center for Interface Quantum Electronics, Hokkaido University
5th Author's Name Hideki HASEGAWA
5th Author's Affiliation Research Center for Interface Quantum Electronics, Hokkaido University
Date 2000/7/21
Paper # ED2000-103
Volume (vol) vol.100
Number (no) 236
Page pp.pp.-
#Pages 8
Date of Issue