Presentation 2000/6/23
ED2000-91 / SDM2000-91 Ultra shallow Boron diffusion in SIMOX and UNIBOND Structures
Hideo Uchida, Masaya Ichimura, Eisuke Arai,
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Abstract(in English) Boron diffusion profiles in three kinds of silicon-on-insulator (SOI) structures with a very thin active layer were compared with those in bulk silicon. SOI structures used were low-dose SIMOX (separation by implanted oxygen) with ITOX (internal thermal oxidation), low-dose SIMOX without ITOX and UNIBOND. Boron diffusion was carried out at 900°C in N_2 ambient, using a spin-on-glass source which enables us to obtain a high surface concentration near solid solubility. The diffusion retardation compared with bulk Si appeared clearly in SIMOXs more than UNIBOND. The reason of this was that recombination velocity of interstitial silicon in the SIMOX is larger than that in the UNIBOND wafer.
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Keyword(in English) SOI / SIMOX / UNIBOND / Boron / Diffusion
Paper # ED2000-91,SDM2000-91
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Conference Date 2000/6/23(1days)
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Language JPN
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Title (in English) ED2000-91 / SDM2000-91 Ultra shallow Boron diffusion in SIMOX and UNIBOND Structures
Sub Title (in English)
Keyword(1) SOI
Keyword(2) SIMOX
Keyword(3) UNIBOND
Keyword(4) Boron
Keyword(5) Diffusion
1st Author's Name Hideo Uchida
1st Author's Affiliation Department of Electrical and Computer Engineering, Nagoya Institute of Technology()
2nd Author's Name Masaya Ichimura
2nd Author's Affiliation Department of Electrical and Computer Engineering, Nagoya Institute of Technology
3rd Author's Name Eisuke Arai
3rd Author's Affiliation Department of Electrical and Computer Engineering, Nagoya Institute of Technology
Date 2000/6/23
Paper # ED2000-91,SDM2000-91
Volume (vol) vol.100
Number (no) 149
Page pp.pp.-
#Pages 5
Date of Issue