Presentation 1999/7/22
A New Software-based Impedance Matching Technique for Silicon RF ICs
KiHyuk Kim, HoiJu Chung, SungHo Yoon, JoongHo Choi, SungWoo Hwang, JinWoo Park, Suwon Kim,
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Abstract(in English) A software-based impedance matching technique for silicon RF ICs is presented. The input impedance is calculated from the SPICE modeling of the packaged chip with the parameters extracted from 3D solvers. Off-chip impedance matching block built from the calculated input impedance exhibits acceptable measurement results.
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Keyword(in English) Silicon RF IC / impedance matching / SPICE / down-converter / 3D simulator
Paper # ED99-112
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Committee ED
Conference Date 1999/7/22(1days)
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Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A New Software-based Impedance Matching Technique for Silicon RF ICs
Sub Title (in English)
Keyword(1) Silicon RF IC
Keyword(2) impedance matching
Keyword(3) SPICE
Keyword(4) down-converter
Keyword(5) 3D simulator
1st Author's Name KiHyuk Kim
1st Author's Affiliation Department of Electronics Engineering, Korea University()
2nd Author's Name HoiJu Chung
2nd Author's Affiliation Department of Electronics Engineering, Korea University
3rd Author's Name SungHo Yoon
3rd Author's Affiliation Samsung Electronics
4th Author's Name JoongHo Choi
4th Author's Affiliation School of Electrical Engineering, University of Seoul
5th Author's Name SungWoo Hwang
5th Author's Affiliation Department of Electronics Engineering, Korea University
6th Author's Name JinWoo Park
6th Author's Affiliation Department of Electronics Engineering, Korea University
7th Author's Name Suwon Kim
7th Author's Affiliation Department of Electronics Engineering, Korea University
Date 1999/7/22
Paper # ED99-112
Volume (vol) vol.99
Number (no) 229
Page pp.pp.-
#Pages 5
Date of Issue