Presentation 1999/7/22
Low temperature formation of gate-grade silicon nitride film employing microwave-excitation high-density plasma
Yuji Saito, Katsuyuki Sekine, Masaki Hirayama, Tadahiro Ohmi,
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Abstract(in English) This paper focuses attention on electrical properties of ultra-thin silicon nitride films grown by radial line slot antenna (RLSA) high-density plasma system at 400℃ as an advanced gate dielectric film. The results show low density of interface trap and bulk charge, lower leakage current than jet vapor deposition (JVD) silicon nitride and thermally grown silicon oxide with same equivalent oxide thickness (EOT). Furthermore, they have high breakdown field intensity, almost no stress-induced leakage current, and very little trap generation even in high-field stress.
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Keyword(in English) Silicon nitride / High-density plasma / Jon bombardment / Gate insulator
Paper # ED99-95
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Committee ED
Conference Date 1999/7/22(1days)
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Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Low temperature formation of gate-grade silicon nitride film employing microwave-excitation high-density plasma
Sub Title (in English)
Keyword(1) Silicon nitride
Keyword(2) High-density plasma
Keyword(3) Jon bombardment
Keyword(4) Gate insulator
1st Author's Name Yuji Saito
1st Author's Affiliation Department of Electronic Engineering, Graduate School of Engineering, Tohoku University()
2nd Author's Name Katsuyuki Sekine
2nd Author's Affiliation Department of Electronic Engineering, Graduate School of Engineering, Tohoku University
3rd Author's Name Masaki Hirayama
3rd Author's Affiliation Department of Electronic Engineering, Graduate School of Engineering, Tohoku University
4th Author's Name Tadahiro Ohmi
4th Author's Affiliation New Industry Creation Hatchery Center, Tohoku University
Date 1999/7/22
Paper # ED99-95
Volume (vol) vol.99
Number (no) 229
Page pp.pp.-
#Pages 6
Date of Issue