Presentation | 1999/6/25 On Board Interconnect Test Technology Suitable for Standard Memory Devices Shinichiro Ikeda, Yoshiharu Kato, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | This paper proposes "Static Component Interconnect Test Technology (SCITT)" which was joint-developed by Fujitsu and Philips Research Laboratory Co. Netherlands. SCITT is one of electric interconnection test technologies of LSI mounted on a printed board; said LSI is equipped with special test circuitry. SCITT is especially suitable for the "complex" memory device which is not easy to access, for instance Synchronous DRAM, Flash Memory, or Direct Rambus DRAM, ets. It can make the memory-interconnection test easy and hi-speed. Moreover, SCITT has a superior advantage to Boundary-Scan which is another similar interconnection test technology. We don't need to add either special terminal to the LSI or special wiring on the board. The special circuitry on the LSI can be built with simple logic with few die size penalties. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | memory / printed board / interconnet test / test time |
Paper # | ED99-68 |
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Conference Information | |
Committee | ED |
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Conference Date | 1999/6/25(1days) |
Place (in Japanese) | (See Japanese page) |
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Topics (in Japanese) | (See Japanese page) |
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Paper Information | |
Registration To | Electron Devices (ED) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | On Board Interconnect Test Technology Suitable for Standard Memory Devices |
Sub Title (in English) | |
Keyword(1) | memory |
Keyword(2) | printed board |
Keyword(3) | interconnet test |
Keyword(4) | test time |
1st Author's Name | Shinichiro Ikeda |
1st Author's Affiliation | Fujitsu VLSI Limited() |
2nd Author's Name | Yoshiharu Kato |
2nd Author's Affiliation | Fujitsu VLSI Limited |
Date | 1999/6/25 |
Paper # | ED99-68 |
Volume (vol) | vol.99 |
Number (no) | 146 |
Page | pp.pp.- |
#Pages | 8 |
Date of Issue |