Presentation 1994/5/20
Reduction of the surface recombination velocity of GaAs by Si^+ implantation -By using the non-contact laser/microwave evaluation method-
Hideaki Yoshida, Yasuo Okuyama, Masaya Ichimura, Akira Usami, Takao Wada,
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Abstract(in English) The surface recombination of GaAs which has a high carrier concentration layer formed by Si^+ implantation at the surface has been investigated using the non-contact laser, microwave evaluation method.First,the dependence on dosage was studied.The results show that the effective surface recombination velocity decreased with dosage because of the high carrier concentration layer formed after the annealing.Second,the dependence on implantation energy was studied The results show that the effective surface recombination velocity increased with energy.The results agree with the numerical calculation results of an effective surface recombination velocity at a high-low junction interface.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) GaAs / surface recombination / Si^+ implantation / non-contact laser/icrowave evaluation method / high carrier concentration layer / high-low junction
Paper # ED94-26,CPM94-27
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Committee ED
Conference Date 1994/5/20(1days)
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Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Reduction of the surface recombination velocity of GaAs by Si^+ implantation -By using the non-contact laser/microwave evaluation method-
Sub Title (in English)
Keyword(1) GaAs
Keyword(2) surface recombination
Keyword(3) Si^+ implantation
Keyword(4) non-contact laser/icrowave evaluation method
Keyword(5) high carrier concentration layer
Keyword(6) high-low junction
1st Author's Name Hideaki Yoshida
1st Author's Affiliation Department of Electnical and Computer Engineering,Nagoya Institute of Technology()
2nd Author's Name Yasuo Okuyama
2nd Author's Affiliation Department of Electnical and Computer Engineering,Nagoya Institute of Technology
3rd Author's Name Masaya Ichimura
3rd Author's Affiliation Department of Electnical and Computer Engineering,Nagoya Institute of Technology
4th Author's Name Akira Usami
4th Author's Affiliation Department of Electnical and Computer Engineering,Nagoya Institute of Technology
5th Author's Name Takao Wada
5th Author's Affiliation Department of Applied Electronics,Daido Institute of Technology
Date 1994/5/20
Paper # ED94-26,CPM94-27
Volume (vol) vol.94
Number (no) 47
Page pp.pp.-
#Pages 8
Date of Issue