Presentation 1994/10/11
Fine Patterning for Sub-quarter Micron Gate GaAs MESFET
Tamotsu Kimura, Tomoyuki Ohshima,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) The fabrication process based on the phase-shifting mask technology using i-line stepper and the anisotropic etching technology using ECR plasma has realized fine-patterning for the sub-quarter micron WAI refractory gate of ion-implanted GaAs MESFETs. The device with the gate length of 0.17 μm fabricated by the pro cess developed,has shown high-speed characteristics of 7.6 ps, gate with good uniformity,which proves the good process control. To understand the characteristics of the fine gate devices precisely,we evaluated the Schottky barrier height with respect to the gate length and the orientation in the range of sub-quarter micron,and found it can be explained by the effect of piezoelectric charges induced under the gate metal.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) GaAs MESFET / sub-quarter micron gate / phase-shifting mask technology / ECR Plasma etching
Paper # ED94-70
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Committee ED
Conference Date 1994/10/11(1days)
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Registration To Electron Devices (ED)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Fine Patterning for Sub-quarter Micron Gate GaAs MESFET
Sub Title (in English)
Keyword(1) GaAs MESFET
Keyword(2) sub-quarter micron gate
Keyword(3) phase-shifting mask technology
Keyword(4) ECR Plasma etching
1st Author's Name Tamotsu Kimura
1st Author's Affiliation Semiconductor Technology Laboratory,Oki Electric()
2nd Author's Name Tomoyuki Ohshima
2nd Author's Affiliation Semiconductor Technology Laboratory,Oki Electric
Date 1994/10/11
Paper # ED94-70
Volume (vol) vol.94
Number (no) 268
Page pp.pp.-
#Pages 6
Date of Issue