Presentation 1994/10/11
Thermally stable GaAs Schottky contacts using double layered WSiN
Kenji Shiojima, Kazumi Nishimura, Masami Tokumitsu, Takumi Nittono, Hirohiko Sugawara, Fumiaki Hyuga,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We have found a way to improve the thermal stability of GaAs, InGaP Schottky contacts by using WSiN with low N content for the Schottky metal.When N content is 10% or less,TEM observation reveals that minroscopic interaction is completly supressed.As a result,a WSiN/GaAs CAP/InGaP Schottky contact shows thermal stabiliy after annealing of 800C for 100 min.even though the GaAs cap is as thin as 25A.We also found that a double layered structure,WSiN(N=37%)/WSiN(N=10%),shows good annealing performance.
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Keyword(in English) GaAs / WSiN / N content / double layered structure / Schottky contact
Paper # ED94-66
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Committee ED
Conference Date 1994/10/11(1days)
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Registration To Electron Devices (ED)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Thermally stable GaAs Schottky contacts using double layered WSiN
Sub Title (in English)
Keyword(1) GaAs
Keyword(2) WSiN
Keyword(3) N content
Keyword(4) double layered structure
Keyword(5) Schottky contact
1st Author's Name Kenji Shiojima
1st Author's Affiliation LSI Laboratories,NTT()
2nd Author's Name Kazumi Nishimura
2nd Author's Affiliation LSI Laboratories,NTT
3rd Author's Name Masami Tokumitsu
3rd Author's Affiliation LSI Laboratories,NTT
4th Author's Name Takumi Nittono
4th Author's Affiliation LSI Laboratories,NTT
5th Author's Name Hirohiko Sugawara
5th Author's Affiliation LSI Laboratories,NTT
6th Author's Name Fumiaki Hyuga
6th Author's Affiliation LSI Laboratories,NTT
Date 1994/10/11
Paper # ED94-66
Volume (vol) vol.94
Number (no) 268
Page pp.pp.-
#Pages 8
Date of Issue