Presentation 1994/9/14
Non-isothermal non-equilibrium simulation of semiconductor devices
Hirofumi Kawashima, Hirokazu Hayashi, Ryo Dang,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) In this paper,we report effects of non-isothermal non- equdlibrium simulation which consistently takes account of both carrier and lattice temperatures on MOSFET characteristics.To obtain stable convergence and high rebability of simulation,some effective methods for solving the energy balance equation are proposed.These include an estimation of initial values,a correction of non-physical negative carrier densities and temperatures which occur during calculation,and an adaptive mesh method.These also result in a faster convergence of the simulation. MOSFET characteristics based on this model are compared with other conventional ones.It is found that non-isothermal non- equilibrium transport effect can not be neglected in small-size semiconductor devices.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) device simulation / energy balance equation / thermal diffusion equation / adaptive mesh method / MOSFET
Paper # ED94-55,SDM94-92,VLD94-52
Date of Issue

Conference Information
Committee ED
Conference Date 1994/9/14(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To Electron Devices (ED)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Non-isothermal non-equilibrium simulation of semiconductor devices
Sub Title (in English)
Keyword(1) device simulation
Keyword(2) energy balance equation
Keyword(3) thermal diffusion equation
Keyword(4) adaptive mesh method
Keyword(5) MOSFET
1st Author's Name Hirofumi Kawashima
1st Author's Affiliation Graduate School of Engineering,Hosei University()
2nd Author's Name Hirokazu Hayashi
2nd Author's Affiliation Oki Electric Industry Company
3rd Author's Name Ryo Dang
3rd Author's Affiliation College of Engineering,Hosei University
Date 1994/9/14
Paper # ED94-55,SDM94-92,VLD94-52
Volume (vol) vol.94
Number (no) 231
Page pp.pp.-
#Pages 8
Date of Issue