Presentation 1998/5/22
Surface nitridation process of silicon dioxide by fluorine and excited nitrogen treatment
Ukyo Mori, Kana Takigawa, Yoji Saito,
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Abstract(in English) In p-chanel MOSFET with poly silicon gate, boron to the substrate penetration through the thin gate oxide changes threshold voltage. Recently, surface nitridation of silicon oxide is required to suppress boron penetration. We tried surface nitridation of silicon oxide by the exposure to fluorine and to excited nitrogen. In this paper, we show depth profile of nitrogen and fluorine in the nitrided oxide. The bonding states of N and F were investigated by x-ray photoelectron spectroscopy. Moreover, the morphology of the nitrided surfaces was investigated by atomic force microscope
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Keyword(in English) oxide / surface nitridation / fluorine / remote plasma / X-ray photoelectron spectroscopy / atomic force microscope
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Conference Date 1998/5/22(1days)
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Language JPN
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Title (in English) Surface nitridation process of silicon dioxide by fluorine and excited nitrogen treatment
Sub Title (in English)
Keyword(1) oxide
Keyword(2) surface nitridation
Keyword(3) fluorine
Keyword(4) remote plasma
Keyword(5) X-ray photoelectron spectroscopy
Keyword(6) atomic force microscope
1st Author's Name Ukyo Mori
1st Author's Affiliation Department of Electric Engineering and Electronics, Faculty of Engineering, Seikei University()
2nd Author's Name Kana Takigawa
2nd Author's Affiliation Department of Electric Engineering and Electronics, Faculty of Engineering, Seikei University
3rd Author's Name Yoji Saito
3rd Author's Affiliation Department of Electric Engineering and Electronics, Faculty of Engineering, Seikei University
Date 1998/5/22
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Volume (vol) vol.98
Number (no) 60
Page pp.pp.-
#Pages 7
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