Presentation 1993/5/20
Process Technology for Combination of Sensor and IC
Susumu Sugiyama,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) The process technology which can be used for combining sensors and ICs on a single chip,applying mechanical and thermal properies of microstructures,made by using micromachining,is described below. For compatibility of sensor process with IC process,features of micromachining,problems of Si anisotropic etching,anisotropic etching using TMAH(tetramethyl ammonium hydroxide),poly-Si sacrificial layer etching,properties of Si nitride thin film are investigated.As the application,a pressure sensor array with combined pressre sensors and processing circuits,and an infrared sensor with combined thermo-elements formed on thermal isolated membranes and detected circuts are presented.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) sensor / integrated circuit(IC) / IC process / pressure sensor / infrared sensor / anisotropic etching
Paper # ED93-21,CPM93-12
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Committee ED
Conference Date 1993/5/20(1days)
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Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Process Technology for Combination of Sensor and IC
Sub Title (in English)
Keyword(1) sensor
Keyword(2) integrated circuit(IC)
Keyword(3) IC process
Keyword(4) pressure sensor
Keyword(5) infrared sensor
Keyword(6) anisotropic etching
1st Author's Name Susumu Sugiyama
1st Author's Affiliation Toyota Central Reseach and Development Laboratories()
Date 1993/5/20
Paper # ED93-21,CPM93-12
Volume (vol) vol.93
Number (no) 45
Page pp.pp.-
#Pages 8
Date of Issue