Presentation 1995/7/20
Optical coupling techniques for Optoelectronic Multichip Module
Shinji Koike, Mitsuo Usui, Hideyuki Takahara,
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Abstract(in English) Novel optical and electrical hybrid packaging techniques for opto-electronics multichip modules (OE-MCMS) using fluorinated polyimide waveguides are descrived. The packaging consists of OE substrates and waveguide-to-flip chip bonded photodiode (PD) or waveguide-to-laser diode (LD) coupling. Proposed OE-substrates are constructed with low loss (0.4dB/cm) waveguide multilayered on copper-polyimide substrates by typical planar processess. Low loss chip-to-waveguide coupling by total internal reflection mirrors (excess loss of 1.5dB) are simultaneously fabricated at the edge of the waveguide by the same processes. Precisely etched terrace within Cu-PI multilayered substrate can align the center of the waveguide core to LD emitting region by simple LD mounting on the terrace and implement low loss (6.5dB) and stable coupling between LD and waveguides.
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Keyword(in English) Optoelectronic Multichip Module / Optical and electronic hybrid packaging / Mirror coupling / Terrace
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Conference Date 1995/7/20(1days)
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Language JPN
Title (in Japanese) (See Japanese page)
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Title (in English) Optical coupling techniques for Optoelectronic Multichip Module
Sub Title (in English)
Keyword(1) Optoelectronic Multichip Module
Keyword(2) Optical and electronic hybrid packaging
Keyword(3) Mirror coupling
Keyword(4) Terrace
1st Author's Name Shinji Koike
1st Author's Affiliation NTT Interdisciplinary Research Laboratories()
2nd Author's Name Mitsuo Usui
2nd Author's Affiliation NTT Interdisciplinary Research Laboratories
3rd Author's Name Hideyuki Takahara
3rd Author's Affiliation NTT Interdisciplinary Research Laboratories
Date 1995/7/20
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Volume (vol) vol.95
Number (no) 156
Page pp.pp.-
#Pages 6
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