Presentation 1997/3/14
Aluminum Single-Electron Devices
J. S. Tsai, Y. Nakamura, C. D. Chen,
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Abstract(in English) Aluminum single-electron device shows an ideal gate modulation characteristic, a rather high current density, a reasonable reproducibility, and its operation is often completely analytical. We have fabricated Al single electron devices having 20 nm islands with an electron-beam lithography. They showed perfect gate modulations and functioned as electrometer up to temperature above 100K. We have also developed an electrochemical micro-fabrication process (ACME process) which could be routinely used to enhance the operation temperature of the Al devices up to 10 times. A room temperature operable device based on these fabrication methods, a single-electron flash memory, was proposed and its operation simulated.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) single-electron device / aluminum tunnel junction / micro-fabrication / charging energy / electron-beam lithography / flash memory
Paper # ED96-220
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Committee ED
Conference Date 1997/3/14(1days)
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Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Aluminum Single-Electron Devices
Sub Title (in English)
Keyword(1) single-electron device
Keyword(2) aluminum tunnel junction
Keyword(3) micro-fabrication
Keyword(4) charging energy
Keyword(5) electron-beam lithography
Keyword(6) flash memory
1st Author's Name J. S. Tsai
1st Author's Affiliation NEC Fundamental Research Laboratories()
2nd Author's Name Y. Nakamura
2nd Author's Affiliation NEC Fundamental Research Laboratories
3rd Author's Name C. D. Chen
3rd Author's Affiliation NEC Fundamental Research Laboratories
Date 1997/3/14
Paper # ED96-220
Volume (vol) vol.96
Number (no) 573
Page pp.pp.-
#Pages 6
Date of Issue