Presentation 1997/7/15
Atomic-scale imaging of compound semiconductors with a noncontact atomic force microscope
Seizo Morita, Yasuhiro Sugawara, Takayuki Uchihashi, Hitoshi Ueyama, Takahiro Tsukamoto,
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Abstract(in English) Recently, using a noncontact ultrahigh vacuum atomic force microscope (UHV-AFM) developed by our group, atomic-scale point defects on compound semiconductor surfaces were observed for the first time. Besides, motion of point defects, point defects with different depths were observed. Further, atomically resolved imagings under the repulsive force in the contact region as well as under the attractive force in the noncontact region were successfully achieved. In the present report, the latest results including ovservations of Si semiconductor surfaces and electrostatic force imaging of point charge in the thin silicon oxide will be presented.
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Keyword(in English) noncontact / UHV-MM / compound semiconductor / atomic resolution / point defect
Paper # ED97-76
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Committee ED
Conference Date 1997/7/15(1days)
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Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Atomic-scale imaging of compound semiconductors with a noncontact atomic force microscope
Sub Title (in English)
Keyword(1) noncontact
Keyword(2) UHV-MM
Keyword(3) compound semiconductor
Keyword(4) atomic resolution
Keyword(5) point defect
1st Author's Name Seizo Morita
1st Author's Affiliation Department of Electronic Engineering, Faculty of Engineering, Osaka University()
2nd Author's Name Yasuhiro Sugawara
2nd Author's Affiliation Department of Electronic Engineering, Faculty of Engineering, Osaka University
3rd Author's Name Takayuki Uchihashi
3rd Author's Affiliation Department of Electronic Engineering, Faculty of Engineering, Osaka University
4th Author's Name Hitoshi Ueyama
4th Author's Affiliation Department of Electronic Engineering, Faculty of Engineering, Osaka University
5th Author's Name Takahiro Tsukamoto
5th Author's Affiliation Department of Electronic Engineering, Faculty of Engineering, Osaka University
Date 1997/7/15
Paper # ED97-76
Volume (vol) vol.97
Number (no) 159
Page pp.pp.-
#Pages 8
Date of Issue