Presentation 2001/7/26
Structural and electric properties of Y_2O_3 thin films formed by Metal-organic decomposition
Shunpei HONMA, Hisashi FUKUDA, Shigeru NOMURA,
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Abstract(in English) Yttrium oxide(Y_2O_3)thin films were formed by metal-organic decomposition(MOD). The Y_2O_3 thin films were well crystallized after 600℃ annealing in oxygen atmosphere. The surface morphology indicates polycrystalline structure with small grains. The Y_2O_3 thin films after 900℃ annealing indicates the dielectric constant of 11 in maximum and leakage current of 10^<-5> A/cm^2 order at 5MV/cm. Next, thinning of the films were carried out by addition of butyl acetate in the MOD. Thin Y_2O_3 films indicates the crystallinity degradation and the decrease of dielectric constants. Low leakage current of 10^<-7> A/cm^2 and higher breakdown strength of 7 MV/cm for well optimized addition of butyl acetate. Minimum equivalent thickness of 6.8 nm was obtained for thin Y_2O_3 films.
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Keyword(in English) metal-organic decomposition / Y_2O_3 / thin films / gate dielectrics / MOFET
Paper # CPM2001-41
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Conference Information
Committee CPM
Conference Date 2001/7/26(1days)
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Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Structural and electric properties of Y_2O_3 thin films formed by Metal-organic decomposition
Sub Title (in English)
Keyword(1) metal-organic decomposition
Keyword(2) Y_2O_3
Keyword(3) thin films
Keyword(4) gate dielectrics
Keyword(5) MOFET
1st Author's Name Shunpei HONMA
1st Author's Affiliation Department of Electrical and Electronic Engineering, Faculty of Engineering, Muroran Institute of Technology()
2nd Author's Name Hisashi FUKUDA
2nd Author's Affiliation Department of Electrical and Electronic Engineering, Faculty of Engineering, Muroran Institute of Technology
3rd Author's Name Shigeru NOMURA
3rd Author's Affiliation Department of Electrical and Electronic Engineering, Faculty of Engineering, Muroran Institute of Technology
Date 2001/7/26
Paper # CPM2001-41
Volume (vol) vol.101
Number (no) 244
Page pp.pp.-
#Pages 6
Date of Issue