Presentation 2001/6/29
Observation of Semiconductor Bonded Films on Piezoelectric substrates by X-Ray diffreaction
Ken-ichiro Miyadai, Tsutomu Nakajima, Yusuke Aoki, Kohji Hohkawa,
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Abstract(in English) Surface acoustic wave (SAW)-semiconductor coupled devices are attractive for realization of high performance and new functional devices. In this paper, we show a process technology for fabrication of SAW-semiconductor coupled device. Especially, we examined a stress of bonded semiconductor films, which were heated to obtain strong bonding strength between a semiconductor films and piezoelectric substrate, by X-ray diffraction method. We clarified the stress distribution of GaAs bonded films.
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Keyword(in English) ELO film bonding / SAW device / GaAs / heating process / stress / distribution
Paper # US2001-27, EMD2001-19 CPM2001-34, OME2001-29
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Committee CPM
Conference Date 2001/6/29(1days)
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Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Observation of Semiconductor Bonded Films on Piezoelectric substrates by X-Ray diffreaction
Sub Title (in English)
Keyword(1) ELO film bonding
Keyword(2) SAW device
Keyword(3) GaAs
Keyword(4) heating process
Keyword(5) stress
Keyword(6) distribution
1st Author's Name Ken-ichiro Miyadai
1st Author's Affiliation Kanagawa Institute of Technology()
2nd Author's Name Tsutomu Nakajima
2nd Author's Affiliation Kanagawa Institute of Technology
3rd Author's Name Yusuke Aoki
3rd Author's Affiliation Kanagawa Institute of Technology
4th Author's Name Kohji Hohkawa
4th Author's Affiliation Kanagawa Institute of Technology
Date 2001/6/29
Paper # US2001-27, EMD2001-19 CPM2001-34, OME2001-29
Volume (vol) vol.101
Number (no) 170
Page pp.pp.-
#Pages 6
Date of Issue