Presentation	2000/12/1 Defect portion detection and it's mode classification in CMOS manufacturing process using fault diagnosis technique by I_ Masaru Sanada, Kazuo Uehira, Eigo Fuse,
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Abstract(in English)	We have developed the diagnosis system to detect the fatal defect portions by using abnormal I_ information, being signal to presence a physical damages in the LSI circuit. This system, applied to Logic LSI manufacturing process, detects the fatal defect in several abnormalities identified with wafer inspection apparatus. After extraction of the abnormal current from various leakage current, and cancellation out the difference between the visual portion by WIA and the LSI layout coordinate, the diagnosis are executed to detect the abnormal portion. The diagnosis result leads the fatal defect rate of each process, defect mode classification, and the relation between visual abnormalities and fatal defects by SEM review.
Keyword(in Japanese)	(See Japanese page)
Keyword(in English)	LSI / I_ / Visual Abnormalities / Fault Diagnosis / Manufacturing Process
Paper #	CPM2000-142,ICD2000-175
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Conference Information
Committee	CPM
Conference Date	2000/12/1(1days)
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Paper Information
Registration To	Component Parts and Materials (CPM)
Language	JPN
Title (in Japanese)	(See Japanese page)
Sub Title (in Japanese)	(See Japanese page)
Title (in English)	Defect portion detection and it's mode classification in CMOS manufacturing process using fault diagnosis technique by I_
Sub Title (in English)
Keyword(1)	LSI
Keyword(2)	I_
Keyword(3)	Visual Abnormalities
Keyword(4)	Fault Diagnosis
Keyword(5)	Manufacturing Process
1st Author's Name	Masaru Sanada
1st Author's Affiliation	Analysis Technology Development Division, NEC Corporation()
2nd Author's Name	Kazuo Uehira
2nd Author's Affiliation	3rd System LSI Division, NEC Corporation
3rd Author's Name	Eigo Fuse
3rd Author's Affiliation	LSI Manufacturing Division, NEC Corporation
Date	2000/12/1
Paper #	CPM2000-142,ICD2000-175
Volume (vol)	vol.100
Number (no)	486
Page	pp.pp.-
#Pages	7
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