Presentation 2000/11/30
A New 3-D Packaging Technology Utilizing Jet Printing System
Takanari SASAYA, Shinichiro KAWAKITA, Kazuhiro TURUTA, Nobuaki KAWAHARA,
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Abstract(in English) This paper reports a new three-dimensional packaging method suitable for high density packaging and allow mixed chip types. In this method, bear chips of LSI are bonded, embedded in a resin mold, polished to 100μm in thickness and stacked layer by layer. The wiring pattern and feed through electrodes made of gold are fabricated by JPS(Jet Printing System)without any photo process. This packaging method was applied to an in-pipe inspection microrobot in order to miniaturize the control circuit. The packaging density of this method was two times higher than conventional 2D packaging.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) three-dimensional / stacked layer / packaging / JPS
Paper # CPM2000-139,ICD2000-172
Date of Issue

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Committee CPM
Conference Date 2000/11/30(1days)
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Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A New 3-D Packaging Technology Utilizing Jet Printing System
Sub Title (in English)
Keyword(1) three-dimensional
Keyword(2) stacked layer
Keyword(3) packaging
Keyword(4) JPS
1st Author's Name Takanari SASAYA
1st Author's Affiliation Research Laboratories DENSO CORPORATION()
2nd Author's Name Shinichiro KAWAKITA
2nd Author's Affiliation Research Laboratories DENSO CORPORATION
3rd Author's Name Kazuhiro TURUTA
3rd Author's Affiliation Research Laboratories DENSO CORPORATION
4th Author's Name Nobuaki KAWAHARA
4th Author's Affiliation Research Laboratories DENSO CORPORATION
Date 2000/11/30
Paper # CPM2000-139,ICD2000-172
Volume (vol) vol.100
Number (no) 485
Page pp.pp.-
#Pages 8
Date of Issue