| Presentation | 2000/11/30 Sn-Ag Solder Bump Process Hirokazu Ezawa, Masahiro Miyata, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | We have developed the eutectic Sn-Ag solder bump process for high pin count ULSIs which require Flip Chip interconnection. In the 2-step electroplating process using separate reactors for Ag and Sn each, the Sn-Ag alloy composition can be easily controlled by varying the thickness ratio of Ag and Sn in an Ag / Sn electroplated metal stack. The thick nega-resist plating mask with steep wall openings does not need complex plating current control. Thus, better within-uniformity of bump height and solder alloy composition can be easily obtained, which leads to a robust mass-producing. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Sn-Ag eutectic alloy / Solder Bump / Flip Chip / Electroplating / Thick nega-resist mask |
| Paper # | CPM2000-136,ICD2000-169 |
| Date of Issue |
| Conference Information | |
| Committee | CPM |
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| Conference Date | 2000/11/30(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Sn-Ag Solder Bump Process |
| Sub Title (in English) | |
| Keyword(1) | Sn-Ag eutectic alloy |
| Keyword(2) | Solder Bump |
| Keyword(3) | Flip Chip |
| Keyword(4) | Electroplating |
| Keyword(5) | Thick nega-resist mask |
| 1st Author's Name | Hirokazu Ezawa |
| 1st Author's Affiliation | Toshiba Corporation Semiconductor Company Advanced ULSI Process Engineering Dept.() |
| 2nd Author's Name | Masahiro Miyata |
| 2nd Author's Affiliation | Toshiba Corporation Semiconductor Company Advanced ULSI Process Engineering Dept. |
| Date | 2000/11/30 |
| Paper # | CPM2000-136,ICD2000-169 |
| Volume (vol) | vol.100 |
| Number (no) | 485 |
| Page | pp.pp.- |
| #Pages | 8 |
| Date of Issue | |