Presentation 2000/11/30
A measurement and simulation study of transmission lines on microstrip and stacked-pair structure for high speed signals
Yasuhiko ODATE, Kanji OTSUKA, Tamotsu USAMI, Tadatomo SUGA,
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Abstract(in English) The main problem for speed-up of signal pulses in transmission lines on the PCB is the interference between signal lines, so-called closstalk noise. In this study, we focused on the relationship between closstalk noise and transmission structures. The most popular transmission structure in PCB is the microstrip structure. But in terms of electromagnetic expanse, this structure can't be said to be the most suitable structure for high-speed signal. Consequently, we compared the signal qualities on the microstrip line and stacked-pair line, which is considered to have less electromagnetic spread. The experimental and simulation results suggested the stacked-pair line is superior to the microstrip line.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) transmission Iine / microstrip line / stacked-pair line
Paper # CPM2000-135,ICD2000-168
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Committee CPM
Conference Date 2000/11/30(1days)
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Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A measurement and simulation study of transmission lines on microstrip and stacked-pair structure for high speed signals
Sub Title (in English)
Keyword(1) transmission Iine
Keyword(2) microstrip line
Keyword(3) stacked-pair line
1st Author's Name Yasuhiko ODATE
1st Author's Affiliation University of Tokyo, RCAST()
2nd Author's Name Kanji OTSUKA
2nd Author's Affiliation / University of Tokyo, RCAST
3rd Author's Name Tamotsu USAMI
3rd Author's Affiliation University of Tokyo, RCAST
4th Author's Name Tadatomo SUGA
4th Author's Affiliation
Date 2000/11/30
Paper # CPM2000-135,ICD2000-168
Volume (vol) vol.100
Number (no) 485
Page pp.pp.-
#Pages 4
Date of Issue