Presentation | 2000/8/17 CPM2000-71 Suppression Effect of the Capacitance Reduction of Thin Film Capacitor by Substituting Ta Nitride with Ta-Al Compound A. Tanabe, M. Yamane, K Sasaki, Y. Abe, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | Although Ta_2N anodized capacitor exhibits excellent heat-proofproperty, the obtained capacitance value is about half of that of Ta anodized capacitor prepared at the same anodization voltage. On the other hand, since the stoichiometric intermetallic compounds are generally stable at high temperatures, it is expected that the capacitance reduction of Ta_2N anodized capacitor can be improved by substituting Ta_2N film with intermetallic compound film composed of valve metals, maintaining excellent heat-proof property. Then, we prepared the stoichiometric intermetallic compound film of Al_3Ta and evaluated the capacitance properties of Al_3Ta anodized film. It was revealed that Al_3 Ta anodized capacitor exhibits excellent heat-proof property, Which is next to that of Ta_2N anodized capacitor, maintaining the 80% capacitance value of that of Ta anodized capacitor. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | the anodized capacitor / the heat-proof property / Al_3Ta intermetallic compound film |
Paper # | CPM2000-71 |
Date of Issue |
Conference Information | |
Committee | CPM |
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Conference Date | 2000/8/17(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | |
Chair | |
Vice Chair | |
Secretary | |
Assistant |
Paper Information | |
Registration To | Component Parts and Materials (CPM) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | CPM2000-71 Suppression Effect of the Capacitance Reduction of Thin Film Capacitor by Substituting Ta Nitride with Ta-Al Compound |
Sub Title (in English) | |
Keyword(1) | the anodized capacitor |
Keyword(2) | the heat-proof property |
Keyword(3) | Al_3Ta intermetallic compound film |
1st Author's Name | A. Tanabe |
1st Author's Affiliation | Kitami Institute of Technology() |
2nd Author's Name | M. Yamane |
2nd Author's Affiliation | Kitami Institute of Technology |
3rd Author's Name | K Sasaki |
3rd Author's Affiliation | Kitami Institute of Technology |
4th Author's Name | Y. Abe |
4th Author's Affiliation | Kitami Institute of Technology |
Date | 2000/8/17 |
Paper # | CPM2000-71 |
Volume (vol) | vol.100 |
Number (no) | 271 |
Page | pp.pp.- |
#Pages | 6 |
Date of Issue |