Presentation 2000/8/17
CPM2000-71 Suppression Effect of the Capacitance Reduction of Thin Film Capacitor by Substituting Ta Nitride with Ta-Al Compound
A. Tanabe, M. Yamane, K Sasaki, Y. Abe,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Although Ta_2N anodized capacitor exhibits excellent heat-proofproperty, the obtained capacitance value is about half of that of Ta anodized capacitor prepared at the same anodization voltage. On the other hand, since the stoichiometric intermetallic compounds are generally stable at high temperatures, it is expected that the capacitance reduction of Ta_2N anodized capacitor can be improved by substituting Ta_2N film with intermetallic compound film composed of valve metals, maintaining excellent heat-proof property. Then, we prepared the stoichiometric intermetallic compound film of Al_3Ta and evaluated the capacitance properties of Al_3Ta anodized film. It was revealed that Al_3 Ta anodized capacitor exhibits excellent heat-proof property, Which is next to that of Ta_2N anodized capacitor, maintaining the 80% capacitance value of that of Ta anodized capacitor.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) the anodized capacitor / the heat-proof property / Al_3Ta intermetallic compound film
Paper # CPM2000-71
Date of Issue

Conference Information
Committee CPM
Conference Date 2000/8/17(1days)
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Paper Information
Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) CPM2000-71 Suppression Effect of the Capacitance Reduction of Thin Film Capacitor by Substituting Ta Nitride with Ta-Al Compound
Sub Title (in English)
Keyword(1) the anodized capacitor
Keyword(2) the heat-proof property
Keyword(3) Al_3Ta intermetallic compound film
1st Author's Name A. Tanabe
1st Author's Affiliation Kitami Institute of Technology()
2nd Author's Name M. Yamane
2nd Author's Affiliation Kitami Institute of Technology
3rd Author's Name K Sasaki
3rd Author's Affiliation Kitami Institute of Technology
4th Author's Name Y. Abe
4th Author's Affiliation Kitami Institute of Technology
Date 2000/8/17
Paper # CPM2000-71
Volume (vol) vol.100
Number (no) 271
Page pp.pp.-
#Pages 6
Date of Issue