Presentation 2000/8/0
EMD2000-47 / CPM2000-62 / OPE2000-59 / LQE2000-53 Inter-chip Optical Interconnection using Polymer Microlens Arrays
Yuzo Ishii, Shinnji Koike, Yoshimitsu Arai, Yasuhiro Ando,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Hybrid integration of VCSEL/PD with Si-LSI and simple deposition of polymer microlens are key technologies to implement out proposed "Optical-I/O chip packging" concept for inter-chip optical interconnections. A Ray-trace simulation suggests that low-loss transmission as low as 0.22 dB between optical-I/O chips can be achieved. An ink-jet and a dispensing methods to make polymer microlenses for efficient couplping are also described.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) inter-chip optical interconnection / optical-I/O chip / microlens / ink-jet / VCSEL / raytrace simulation
Paper # EMD2000-47,CPM2000-62,OPE2000-59,LQE2000-53
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Conference Information
Committee CPM
Conference Date 2000/8/0(1days)
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Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) EMD2000-47 / CPM2000-62 / OPE2000-59 / LQE2000-53 Inter-chip Optical Interconnection using Polymer Microlens Arrays
Sub Title (in English)
Keyword(1) inter-chip optical interconnection
Keyword(2) optical-I/O chip
Keyword(3) microlens
Keyword(4) ink-jet
Keyword(5) VCSEL
Keyword(6) raytrace simulation
1st Author's Name Yuzo Ishii
1st Author's Affiliation NTT Telecommunications Energy Laboratories()
2nd Author's Name Shinnji Koike
2nd Author's Affiliation NTT Telecommunications Energy Laboratories
3rd Author's Name Yoshimitsu Arai
3rd Author's Affiliation NTT Telecommunications Energy Laboratories
4th Author's Name Yasuhiro Ando
4th Author's Affiliation NTT Telecommunications Energy Laboratories
Date 2000/8/0
Paper # EMD2000-47,CPM2000-62,OPE2000-59,LQE2000-53
Volume (vol) vol.100
Number (no) 260
Page pp.pp.-
#Pages 6
Date of Issue