Presentation 2000/5/12
Surface nitridation process of silicon dioxide by fluorine and excited nitrogen treatment(2)
Koichi Tokuda, Tatsuya Ibe, Yoji Saito,
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Abstract(in English) In p-chanel MOSFETs, Boron dopant penetration through the thin gate oxide changes threshold voltage. Surface nitridation of silicon oxide is will be effective to suppress the boron penetration. In this paper, we tried surface nitridation of silicon oxide by the exposure to fluorine and to remote-plasma-excited nitrogen. we investigated depth profile of nitrogen and fluorine in the nitrided oxide by angle resolved x-ray photoelectron spectroscopy. Moreover, we fabricated MOS capacitors with the nitrided oxide and measured high-frequency C-V characteristics.
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Keyword(in English) oxide / surface nitridation / fluorine / x-ray photoelectron spectroscopy
Paper # ED2000-36, CPM2000-21, SDM2000-36
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Committee CPM
Conference Date 2000/5/12(1days)
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Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Surface nitridation process of silicon dioxide by fluorine and excited nitrogen treatment(2)
Sub Title (in English)
Keyword(1) oxide
Keyword(2) surface nitridation
Keyword(3) fluorine
Keyword(4) x-ray photoelectron spectroscopy
1st Author's Name Koichi Tokuda
1st Author's Affiliation Department of Electric Engineering and Electronics, Faculty of Engineering, Seikei University()
2nd Author's Name Tatsuya Ibe
2nd Author's Affiliation Department of Electric Engineering and Electronics, Faculty of Engineering, Seikie University
3rd Author's Name Yoji Saito
3rd Author's Affiliation Department of Electric Engineering and Electronics, Faculty of Engineering, Seikie University
Date 2000/5/12
Paper # ED2000-36, CPM2000-21, SDM2000-36
Volume (vol) vol.100
Number (no) 60
Page pp.pp.-
#Pages 6
Date of Issue