Presentation 1998/11/5
HJFET Structure with Thick Strained InAs Channel : Beyond the Critical Thickness
T. Nakayama, H. Miyamoto,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We successfully realized a modulation-doped structure on InP substrate with a thick strained InAs channel, the thickness of which was two times thicker than the previously reported critical thickness. In our structure, an AlAs layer was inserted between an InAlAs spacer layer and the thick strained InAs channel to prevent two-dimensional to three-dimensional transition occurred at InAlAs/InAs heterointerface. Using a thick(7nm)strained InAs layer as a channel, we simultaneously achieved high electron mobility of 18,500cm^2/Vs and high sheet carrier density of 3.13x10^<12>cm^<-2> in the modulation doped structure on InP substrate.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) InAs / strained layer / critical thickness / mobility / MBE
Paper # ED98-130,CPM98-133
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Conference Information
Committee CPM
Conference Date 1998/11/5(1days)
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Paper Information
Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) HJFET Structure with Thick Strained InAs Channel : Beyond the Critical Thickness
Sub Title (in English)
Keyword(1) InAs
Keyword(2) strained layer
Keyword(3) critical thickness
Keyword(4) mobility
Keyword(5) MBE
1st Author's Name T. Nakayama
1st Author's Affiliation Optoelectronics and High Frequency Device Research Laboratories, NEC Corporation()
2nd Author's Name H. Miyamoto
2nd Author's Affiliation Kansai Electronics Research Laboratories, NEC Corporation
Date 1998/11/5
Paper # ED98-130,CPM98-133
Volume (vol) vol.98
Number (no) 385
Page pp.pp.-
#Pages 6
Date of Issue