Presentation 1998/10/29
Diffusion and reaction of V-N thin film as an interposed layer at the Cu/SiO_2 interface
Masakazu SAKAGAMI, Mayumi B. TAKEYAMA, Atsushi NOYA,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) The interposed V-N layer was employed at the Cu/SiO_2 interface to improve the poor adhesion of Cu to SiO_2 and Cu diffusion into SiO_2. the examined Cu.V-N/SiO_2/Si system was farely stable upon annealing at 850℃ for 1h reducing the pile-up of V at the Cu surface and the reaction at the SiO_2 surface which were observed when the V layer was used as a barrier. These phenomena were ascribed to the chemical stability of V-N compound and a fine structure of the prepared V-N layer.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Cu metallizatioh / interlayer / adhesion promoter / diffusion barrier / V-N thin film
Paper # CPM98-119
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Committee CPM
Conference Date 1998/10/29(1days)
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Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Diffusion and reaction of V-N thin film as an interposed layer at the Cu/SiO_2 interface
Sub Title (in English)
Keyword(1) Cu metallizatioh
Keyword(2) interlayer
Keyword(3) adhesion promoter
Keyword(4) diffusion barrier
Keyword(5) V-N thin film
1st Author's Name Masakazu SAKAGAMI
1st Author's Affiliation Dept. of Electrical and Electronic Engineering, Kitami Institute of Technology()
2nd Author's Name Mayumi B. TAKEYAMA
2nd Author's Affiliation Dept. of Electrical and Electronic Engineering, Kitami Institute of Technology
3rd Author's Name Atsushi NOYA
3rd Author's Affiliation Dept. of Electrical and Electronic Engineering, Kitami Institute of Technology
Date 1998/10/29
Paper # CPM98-119
Volume (vol) vol.98
Number (no) 376
Page pp.pp.-
#Pages 6
Date of Issue