Presentation	1998/12/10 Development of ball bump forming process and machine using solder paste Junji Fujino,
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Abstract(in Japanese)	(See Japanese page)
Abstract(in English)	LSI package with ball bump elctrodes become popular and solder bumps is adopted even to the flip chip connection. Therefore ball bumps of the finer pitch forming process development is a pressing need. The author have developed an unique process which satisfies bump dimension standard using low-cost solder paste. The process is as follows. Solder paste is filled in openings formed by interposing stencils onto base plates, and is melted and transferred on PCBs to be ball bumps. The machine was applicable to the mass production of CSP of 0.8mm pitch. Also, bump forming of 0.14mm pitch was examined.
Keyword(in Japanese)	(See Japanese page)
Keyword(in English)	Ball bump / Solder paste / Transfer / BGA / CSP
Paper #	CPM98-151,ICD98-230
Date of Issue

Conference Information
Committee	CPM
Conference Date	1998/12/10(1days)
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Place (in English)
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Paper Information
Registration To	Component Parts and Materials (CPM)
Language	JPN
Title (in Japanese)	(See Japanese page)
Sub Title (in Japanese)	(See Japanese page)
Title (in English)	Development of ball bump forming process and machine using solder paste
Sub Title (in English)
Keyword(1)	Ball bump
Keyword(2)	Solder paste
Keyword(3)	Transfer
Keyword(4)	BGA
Keyword(5)	CSP
1st Author's Name	Junji Fujino
1st Author's Affiliation	Manufacturing Engineering Center, Mitsubishi Electric Corp.()
Date	1998/12/10
Paper #	CPM98-151,ICD98-230
Volume (vol)	vol.98
Number (no)	456
Page	pp.pp.-
#Pages	5
Date of Issue