Presentation 1994/9/13
Diffusion behavior of the transition metal in the Cu/IVa- transition metal/Si contact system
Mayumi Takeyama, Atsushi Noya, Katsutaka Sasaki, Hiroki Hatakeyama,
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Abstract(in English) The diffusion behavior taking place in the Cu, lVa Transition Metal/Si contact system has been examined using Auger electron spectroscopy(AES)and x-ray photoelectron spectroscopy(XPS)analyses. It is found that the diffusion of the transition metal toward the surface of the contact system is effectively suppressed by placing the thin transition metal layer at the surface of the Cu in the present system.Also,the transition metal as the overlayer is possible to decisive the surface oxidation of the Cu surface.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Cu metallization / diffusion behavior / transition metal / affinity for oxygen / surface oxidation
Paper # CPM94-68
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Committee CPM
Conference Date 1994/9/13(1days)
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Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Diffusion behavior of the transition metal in the Cu/IVa- transition metal/Si contact system
Sub Title (in English)
Keyword(1) Cu metallization
Keyword(2) diffusion behavior
Keyword(3) transition metal
Keyword(4) affinity for oxygen
Keyword(5) surface oxidation
1st Author's Name Mayumi Takeyama
1st Author's Affiliation Department of Electrical and Electronic Engineering,Faculty of Engineering,Kitami Institute of Technology()
2nd Author's Name Atsushi Noya
2nd Author's Affiliation Department of Electrical and Electronic Engineering,Faculty of Engineering,Kitami Institute of Technology
3rd Author's Name Katsutaka Sasaki
3rd Author's Affiliation Department of Material Science,Faculty of Engineering,Kitami Institute of Technology
4th Author's Name Hiroki Hatakeyama
4th Author's Affiliation Department of Electrical and Electronic Engineering,Faculty of Engineering,Kitami Institute of Technology
Date 1994/9/13
Paper # CPM94-68
Volume (vol) vol.94
Number (no) 227
Page pp.pp.-
#Pages 6
Date of Issue