| Presentation | 1994/9/12 Application of amorphous Cu-Zr alloy films Combined with Zr or Zr- N layers for the Contact system of Cu/Si Shinya Kagomi, Mayumi Takeyama, Atsushi Noya, Katsutaka Sasaki, Kouichirou Sakanshi, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | The barrier properties of the amorphous Cu-Zr alloy film combined with Zr or Zr-N layer interposed between Cu and Si were examined by the depth profiling techniques using the Auger electron spectoscopy analysis.It is found that the Cu, Cu-Zr/Zr/Si and Cu/Cu-Zr/Zr-N/Si systems are stable up to the temperatures of 450℃ and 550℃ due to the annealing,respectively,although the form ation of Cu-Zr-Si temary alloy is the direction of the reaction taking place in these systems.The present amomhous alloy is found to be effective as a barrier for preventing the Cu diffusion in the contact system. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Cu metallization technology / diffusion barrier / Cu-Zr amorphous alloy / metal-Semicondactor Contact / Cu-interconnect line |
| Paper # | CPM94-63 |
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| Conference Information | |
| Committee | CPM |
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| Conference Date | 1994/9/12(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Application of amorphous Cu-Zr alloy films Combined with Zr or Zr- N layers for the Contact system of Cu/Si |
| Sub Title (in English) | |
| Keyword(1) | Cu metallization technology |
| Keyword(2) | diffusion barrier |
| Keyword(3) | Cu-Zr amorphous alloy |
| Keyword(4) | metal-Semicondactor Contact |
| Keyword(5) | Cu-interconnect line |
| 1st Author's Name | Shinya Kagomi |
| 1st Author's Affiliation | Department of Electrical and Electronic Engineering,Faculty of Engineering,Kitami Institute of Technology() |
| 2nd Author's Name | Mayumi Takeyama |
| 2nd Author's Affiliation | Department of Electrical and Electronic Engineering,Faculty of Engineering,Kitami Institute of Technology |
| 3rd Author's Name | Atsushi Noya |
| 3rd Author's Affiliation | Department of Electrical and Electronic Engineering,Faculty of Engineering,Kitami Institute of Technology |
| 4th Author's Name | Katsutaka Sasaki |
| 4th Author's Affiliation | Department of Material Science,Faculty of Engineering,Kitami Institute of Technology |
| 5th Author's Name | Kouichirou Sakanshi |
| 5th Author's Affiliation | Department of Electrical and Electronic Engineering,Faculty of Engineering,Kitami Institute of Technology |
| Date | 1994/9/12 |
| Paper # | CPM94-63 |
| Volume (vol) | vol.94 |
| Number (no) | 226 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |