| Presentation | 1993/10/18 Optical waveguide interconnection for Opto-electronics multichip modules Hideyuki Takahara, Shinji Koike, Nobusuke Matsui, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Novel optical and electrical hybrid packaging techniques for opto-electronics multichip modules(OE-MCMs)using fluorinated polyimide waveguides are described.The packaging consists of OE substrates and waveguide-to-flip chip bonded photodiode(PD)or fibers coupling.Proposed OE substrates are constructed with low loss(0.4dB, cm)waveguides multilayered on copper-polyimide substrates by typical planer processes.Low loss chip-to-waveguide coupling mirrors(excess loss of1.5dB)are simultaneously fabricated at the edge of the waveguide by the same planer processes. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | OE-substrate / Mirror coupling / OE-MCM / Flip-chip bonding |
| Paper # | CPM93-80 |
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| Conference Information | |
| Committee | CPM |
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| Conference Date | 1993/10/18(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Optical waveguide interconnection for Opto-electronics multichip modules |
| Sub Title (in English) | |
| Keyword(1) | OE-substrate |
| Keyword(2) | Mirror coupling |
| Keyword(3) | OE-MCM |
| Keyword(4) | Flip-chip bonding |
| 1st Author's Name | Hideyuki Takahara |
| 1st Author's Affiliation | NTT Interdisciplinary Research Laboratorys() |
| 2nd Author's Name | Shinji Koike |
| 2nd Author's Affiliation | NTT Interdisciplinary Research Laboratorys |
| 3rd Author's Name | Nobusuke Matsui |
| 3rd Author's Affiliation | NTT Interdisciplinary Research Laboratorys |
| Date | 1993/10/18 |
| Paper # | CPM93-80 |
| Volume (vol) | vol.93 |
| Number (no) | 275 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |