Presentation 1993/10/18
Planarization Process of Copper-Polyimide Mulutilayered Substrates
Yukio Kasuya, Yoshiro Takahashi, Yasuo Iguchi, Takashi Kanamori,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We reviewed a planarization proces using a etchback method in a via-post conection type copper-polyimide thin film multilayered substrate.We carried out fundamental studie of the degree of planarization of a polyimide and a photoresist Which is used as a sacrifical layer,the etching rates of polyimide and photoresist, and the pull strength between planarized polyimide and copper using wiring conductor.Then,we used a planarrization process based on the etchback method to fabricate a thin film multilayered substrate,made an evalution of a reliability(the rate of change in connection resistance,the insulation resistance)and measured the high -frequency characteristics(the characteristic impedance,the transmission loss).
Keyword(in Japanese) (See Japanese page)
Keyword(in English) polyimide / etchback method / D.O.P / sacrifrcal layer
Paper # CPM93-79
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Conference Information
Committee CPM
Conference Date 1993/10/18(1days)
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Paper Information
Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Planarization Process of Copper-Polyimide Mulutilayered Substrates
Sub Title (in English)
Keyword(1) polyimide
Keyword(2) etchback method
Keyword(3) D.O.P
Keyword(4) sacrifrcal layer
1st Author's Name Yukio Kasuya
1st Author's Affiliation OKI Electric Industry()
2nd Author's Name Yoshiro Takahashi
2nd Author's Affiliation OKI Electric Industry
3rd Author's Name Yasuo Iguchi
3rd Author's Affiliation OKI Electric Industry
4th Author's Name Takashi Kanamori
4th Author's Affiliation OKI Electric Industry
Date 1993/10/18
Paper # CPM93-79
Volume (vol) vol.93
Number (no) 275
Page pp.pp.-
#Pages 6
Date of Issue